Resources

The mission of the Heterogeneous Integration Roadmap is to provide guidance to the profession, industry, academia and government to identify key technical challenges with sufficient lead time that they do not become roadblocks preventing the continued progress in electronics.

University of Florida  paper proposing a three-tier security approach for secure heterogeneous integration considering supply chain security risks, threats, and vulnerabilities at the chiplet, interposer, and system level. 

Chapter 12 of the the IEEE  Heterogeneous Integration Roadmap covers the challenges for the 5G application space. It considers the needs of next generation of RF Front-End (RFFE) electronics to develop a roadmap for heterogeneously integrated components.

Chapter 9 covers the packaging of photonics based systems. Photonics systems are fundamental to data transmission and have been used for the generation of data through optical-based sensors, there is also a field of research in photonics for processing of data.

Cap Gemini have produced an interesting report on the semiconductor ecosystem and the down-stream industries that depend on it.

The cost of Electrostatic Discharge (ESD) in damaged electronic devices is estimated to be in Billions of Dollars. The loss increases as the complexity of the system grows.