Welcome to the CHIMES area dedicated to Pathways to Manufacture that describe the IKCs knowledge of HI manufacturing capability both in the UK and globally.
The IKC recognises that UK systems designers need to be competitive in addressing the needs of their markets, based on the best options for their fabrication supply chains. But how do we decide the best options?
Part of our knowledge is to catalogue options of known HI manufacturing capability. Rather than just a simple list of sources how can we determine the best options? We need a better understanding of 'evidenced' capability, to help the UK system design community access the most appropriate and credible pathway to manufacture for their products. In other domains consumers are helped by the likes of Which?, CheckaTrade and TrustPilot. The UK community and the IKC are still developing a view of what 'evidenced' capability means but for now the understanding is based like TrustPilot on Reviews by the UK design community and like Which? on some evidenced capability verified by the IKC.
The Science and Technology Facilities Council provide electronics assembly and packaging services for electronic systems with a primary focus on the assembly and packaging of semiconductor devices such as readout ASICs combined with a variety of radiation detectors. AIM Photonics is an research and development center run by the State University of New York offering a range of multipart wafer services for integrated photonics including electronic interposer wafer services w
Pathway
Description
Reviews
IKC
STFC - Interconnect
AIM Photonics
A key advantage of HI is that it allows semiconductor parts to be combined from various manufacturing sources. The IKC will look to promote UK pathways to manufacture but also where necessary (e.g. advanced node CMOS) support the use of global manufacturing capabilities and mesh them via HI with current and emerging UK capabilities.
The IKC will engage actively with indigenous UK manufacturing and advanced packaging capability, integrating such capabilities within the Core Design of reusable reference design and design workflow for HI. It will work to ensure these capabilities are easily access by UK designers using their preferred design tools by working with UK pathways of the verification of appropriate process design kits (PDKs) that can be used with the design tools to support the HI design process.
As the IKC develops capability in both core design and industrial project application we hope to offer UK entities and Advisory Service to help provide clear supply chain options and risks. The aim of the IKC is to identify and confirm proven pathways via sharing expertise of use and utility of pathways across the UK electronic systems market.
As the market for HI in electronic systems develops we anticipate that Global electronic components market will evolve to support bare die supply in addition to the current packaged die supply path for Printed Circuit Board manufacture. One of the tasks of the IKC is to prepare the UK Contract Manufacturing base to be in a position to support bare die and chiplet based heterogenous integration as part of their support for UK electronic product companies.
The IKC will work with the UK 'first movers' in the market and UK strategic investments to ensure the UK does not fall behind global competition.