Investment in Skills and Training

The IKC will work alongside other investments in skills and training within the UK Semiconductor Strategy to upskill the UK electronic systems design community. The focus of the skills development activities within the IKC will be on a collection of educational resources to assist UK industry to adopt HI techniques. These will cover both activities to target training within the academic community for new entrants into UK industry and Continuous Professional Development for those already in work.

The IKC will develop curricula and training packages that focus on the practical skills on how HI techniques can be beneficial to the UK electronic systems community.

The objective is to expand the pool of HI skilled engineers in the UK.

Below are summaries of various skills associated with CHIMES.

Name	Description	Resources
Micro-Transfer Printing (MTP or µTP)	Micro-Transfer Printing enables the transfer of semiconductor parts fabricated in one material system including GaAs, InP, GaN, etc. to be attached to substrate in another material system with high precision and accuracy.	Micro Transfer Printing of Heterogeneous Integrated Compound Semiconductor Components
Micro-Transfer Printing - Tyndall National Institute	Tyndall National Institute, Cork/Ireland offer a 2-day in-person training course with both lectures and practical lab work. Cost: 380.00 EURO	Course Description

Name

Description

Resources

Micro-Transfer Printing (MTP or µTP)

Micro-Transfer Printing enables the transfer of semiconductor parts fabricated in one material system including GaAs, InP, GaN, etc. to be attached to substrate in another material system with high precision and accuracy.

Micro Transfer Printing of Heterogeneous Integrated Compound Semiconductor Components

Micro-Transfer Printing - Tyndall National Institute

Tyndall National Institute, Cork/Ireland offer a 2-day in-person training course with both lectures and practical lab work.

Cost: 380.00 EURO

Course Description