Co-Creation Projects
Ibrahim
A core part of the IKC activity is a managed programme of industry-led co-created projects. We aim to have partners that cover a range of markets where the UK has strength, power management, wireless communications, photonics and sensors. This list is not exhaustive.
IKC projects will build Proof of Concept (PoC) offerings that demonstrate the advantage of HI techniques. They will also validate the core design and knowledge assets that the IKC develops to support the broader UK semiconductor community. The PoCs will aim to represent categories of HI systems and act as exemplars to the UK electronic systems community. Our aim is that these PoCs will give confidence to UK businesses to invest in new products utilising HI techniques.
We expect the PoCs to represent different challenges to design methodologies, tools, materials and systems architecture. The projects should develop additional design and knowledge assets to extend and enhance the core design base of the IKC that can be reused and applied to other systems. Finally the projects will show pathways for UK business to make marketable products that in term contribution to UK economy.
Our project teams will include both academic and industry members and this will help expand the pool of HI skilled engineers in the UK. We also aim to build early translation pathways for core research into system integration projects for real-world industrial application. In this way the IKC will promote a model of shared endeavour and knowledge sharing of the latest advances, reuse strategies and industrial context for the broader benefit of the UK semiconductor community.
We hope our projects will enable UK industry to gain insight into advances in the broader global semiconductor industry.
The INTERPOSE-UK project was one of 16 projects funded by Innovate UK to improve and scale-up semiconductor manufacturing and supply chains. The aim of the project was to develop UK capability to produce bespoke interposers, enabling UK companies to capitalise on the heterogeneous integration technologies needed for next generation chip integration. Interposers are functional substrates that enable electrical connectivity between different semiconductor chips in advanced packaging applications.
The partners in the activity are:
John Darlington
