
The mission of the Heterogeneous Integration Roadmap is to provide guidance to the profession, industry, academia and government to identify key technical challenges with sufficient lead time that they do not become roadblocks preventing the continued progress in electronics. The approach is to identify the requirements for heterogeneous integration in the electronics industry through 2034, determine the difficult challenges that must be overcome to meet these requirements and, where possible, identify potential solutions.
The Roadmapping processes are transparent and the work product is published on the IEEE Electronics Packaging Society (EPS) web site, available to the Profession, Industry, Academia and Research Institutes without charge.
Explore This Resource
Resources
Add new comment
To post a comment on this article, please log in to your account. New users can create an account.