Pathways to Manufacture

The IKC recognises that UK systems designers need to be competitive in addressing the needs of their markets, based on the best options for their fabrication supply chains. A key advantage of HI is that it allows semiconductor parts to be combined from various manufacturing sources. The IKC will look to promote UK oriented
investments in pathways to manufacture but also where necessary (e.g. advanced node CMOS) support the use of global manufacturing capabilities and mesh them via HI with current and emerging UK capabilities.

The IKC will engage actively with indigenous UK manufacturing and advanced packaging capability, integrating such capabilities within the Core Design of reusable reference design and design workflow for HI. It will work to ensure these capabilities are easily access by UK designers using their preferred design tools by working with UK pathways of the verification of appropriate process design kits (PDKs) that can be used with the design tools to support the HI design process.

Below are summaries of various pathways to manufacture associated with CHIMES.

Name	Description	Resources
STFC - Interconnect	The Science and Technology Facilities Council provide electronics assembly and packaging services for electronic systems with a primary focus on the assembly and packaging of semiconductor devices such as readout ASICs combined with a variety of radiation detectors.	STFC Interconnect
AIM Photonics	AIM Photonics is an research and development center run by the State University of New York offering a range of multipart wafer services for integrated photonics including electronic interposer wafer services w	silicon photonics fabrication pathway