The CHIMES2 Sheffield engineering team, accompanied by some talented undergraduate students from The University of Sheffield, travelled to Leuven to attend the Europractice course, "ASIC Design Introduction: From Concept to Silicon" on the 24-28th of August.
The week-long program offered a comprehensive overview of the end-to-end ASIC design lifecycle. Going beyond core design principles, the syllabus covered a broad range of industry topics, such as advanced packaging techniques, chip and packaging co-design, and how to design chips using leading-edge lithography nodes from foundries such as TSMC.
The knowledge and insight gained here will help to ensure our team is aligned with industry best practices and keeps up to date with the latest technologies.
Thank you to the engineers and scientists at imec for organizing and delivering the training.
