On the 26th of May, the CHIMES Executive Leadership Team made their way to Andover to visit Custom Interconnect Ltd (CIL) at their 64,000sq ft state-of-the-art facilities.
As a leading UK provider of electronics contract manufacturing and microelectronics packaging, CIL plays a pivotal role in bringing complex semiconductor assemblies from initial development into medium-volume production. The visit provided an invaluable opportunity for the CHIMES leadership team to tour CIL’s advanced packaging and cleanroom facilities,while discussing shared strategic goals for the UK's semiconductor ecosystem.
CIL has a 40-year track record in the manufacture of Printed Circuit Board Assemblies (PCBA) and Outsourced Semiconductor Packaging and Test (OSAT). For more information on CIL please visit: https://www.cil-uk.co.uk/ or get in touch chimes@sheffield.ac.uk
Our thanks to John Boston, Managing Director of Custom Interconnect Ltd, for hosting our team and sharing valuable insights into their operations.