The UK Microsystems Network Packaging and Integration SIG hosted a full-day workshop on Wednesday 10th of June at the University of Southampton. This free event attracted delegates from UK industry, national facilities, innovation centres and academia, showcasing cutting-edge approaches to heterogeneous integration, sustainability, quantum photonics, and product reliability—underscoring the crucial role packaging plays in national semiconductor innovation.
The event was opened by CHIMES2 Co-I Dr Ibrahim Sari, with Co-I Professor John Darlington presenting during the final session, introducing the IKC to a new audience.
If you would like to find out more about this event, please get in touch CHIMES@Sheffield.ac.uk
