On Wednesday the 2nd of September, members of the CHIMES2 team joined 54 researchers, industry leaders, and academic institutions at the University of Warwick for the 2nd iMAPS Academic Conference on Advanced Packaging R&D in the UK. The in-person event successfully fostered collaboration across microelectronics, power electronics, quantum, and photonics assembly, bridging the divide between pioneering academic research and commercial industrial needs.
The packed programme featured key international and national insights, highlighted by keynote presentations from Tanja Braun of Fraunhofer IZM on panel-level packaging and Anthony Chapman representing the EPSRC. Attendees also explored updates from major collaborative UK research initiatives, including the REWIRE IKC, REACT, INTERPOSE UK, with CHIMES2 Co-I Professor Chee Tan presenting in session 2.
A central panel session chaired by King's College London addressed crucial alignment between industrial demands and academic research pipelines, while early-career researchers showcased cutting-edge developments in ceramic substrates, hermetic package testing, and power modules.
If you would like more information about iMAPS please visit their website: https://www.imaps.org.uk/