Advanced packaging and heterogeneous integration are rapidly becoming the defining challenge for next-generation microelectronics. This free one-day workshop brings together leading voices from UK industry, national facilities, innovation centres, and academia to provide a comprehensive view of where we are and what needs to happen next in the UK.
Organised by CHIMES Co-I Ibrahim Sari and hosted by the UK Microsystems Network, this workshop will cover topics including:
- Semiconductor sustainability and low-carbon FlexIC technology
- Advanced packaging for scientific instruments
- Semiconductor quantum photonic devices
- Additive manufacturing of advanced packages
- Package reliability and failure analysis
- Power electronics and photonics
- The UK advanced packaging industry landscape
- The role of national centres, professional bodies, and innovation ecosystems
The event takes place at the University of Southampton on 10 June. It is free to attend but requires registration.